978-0-8493-9625-0
Electronic Packaging Materials and Their Properties
Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour and Rahul
Editorial: CRC Press Fecha de publicación: 18/12/1998 Páginas: 128Formato: Hardback 235 x 156 mm
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
• Electronic Packaging
Electronic Packaging
Electromagnetics & Microwaves
Reference
Professional